In recent years, new product development and application of epoxy technology progresses rapidly, particularly composites, coatings, adhesives, curing agents, epoxy resin toughness, liquid epoxy resin and a catalyst to promote the agent products, which is a new material needs of development, we should take it seriously.
A composite material
1, glass beads epoxy composite
Glass beads treated with a silane coupling agent (SA) (GB) surface to the bisphenol A type epoxy resin (E828) and ethylene diamine (EDA) used as a curing agent for the composite material matrix, γ- AMINOPROPYLTRIMETHOXYSILANES silane (APS), γ- aminopropyl triethoxysilane (AES) and 2 hydrogen-ethylbenzene silane (AAPS) is used as the treatment agent, the processing conditions and mechanical properties of their relationship were studied. The results showed that: ① a glass transition temperature of the composite material (Tg), flexural modulus and flexural strength of the optimal sequence of the maximum concentration of an aqueous solution of SA is AAS <AES <AAPS. ② When the mechanical properties of the composite material reaches the maximum value, SA aqueous hydrolysis time depends on the SA is an inorganic group, an ethoxy group Bijia take longer. ③ extent under the process conditions established by curing the matrix of the SA and E828 reactivity studies. LB after the surface treatment at 80-150 ℃ mixed with E828, EDA plus curing agent, and E828 SA to increase the extent of reaction. Results of 150 ℃ than 80 ℃ blend composite Tg is high.
2, silicon filled epoxy composites
Epoxy resin is used as a composite matrix resin, excellent mechanical properties, but long-term use at high temperatures there will be time and temperature characteristics. Static bending and fatigue tests the test of time and temperature on the flexural strength. The results shows that the time - temperature superposition principle applies to the static bending strength. Compared with pure matrix resins and composites, pure resin composite material is a major factor of static strength and temperature characteristics of. Fatigue tests showed that the time-temperature superposition principle applies to the initial elastic strength matrix resin, when the temperature, the stress LLt aid D, affected by the presence of plastic deformation, bending strength and modulus increased.
3, mosaic graphite epoxy composite damping material laminates
CPC cured composite high elastic damping material damping performance effectively improve the damping properties of the material, however, when the damping material does not reach the laminate curing period, damping performance is often not as good as the secondary bonding composites . And the secondary co-curing adhesive between samples of different reasons damping resin to penetrate into the vibration damping material actions. Between the damping material and epoxy resin sample compartment of the co-cured FasTapell25 than no effective barrier loss coefficient (video rate may be) to be higher by 15.7% -92.3%, while the ratio of total no barrier curing ISDll2 sample of at least 168 percent higher. Such damping value reached close to the second value of the bonding. The results show that the majority of the viscoelastic damping material are affected by the temperature of the curing period.
4, carbon fiber epoxy composite
Research shows that impurities on the carbon fiber reinforced epoxy composite mechanical properties affected. Whether the sample is first subjected to curing or after curing are impurities (water, water, acids, bases and organic solvents) contamination in the manufacturing process and application and therefore, the control of environmental factors is important.
5, epoxy resin infused composite materials
Manufactured by Ciba Specialty Chemicals Inc. kinds of new two-component epoxy potting compound Resinfusion 8603 in aerospace, transportation and marine applications, the gel time 78min, low viscosity 260cP (1cP = 10-3Pa.s) , the resin 25 ℃, 24h cured.
Second, the paint
A cationic epoxy resin release coating
Rhodia company was the first to launch a new series of cations in epoxy - silicone release coating, the electron beam and ultraviolet light used in conjunction, used as transfer paper, film and foil pressure sensitive tapes and labels such as clothing film production line and so on.
2, coating additives
Ciba Specialty Chemical Company "Ardldite-Epoxidharze" used in the construction industry, as a component of paint, coatings and construction chemicals resist material, fixed in cold adhesive systems, with cured epoxy adhesives 793 together with an adhesive agent Euredur450 surface.
3, epoxy floor paint
US developed SL1300 floor coatings, the coating does not smoke, the day the smell, and rapidly solidified, 24h can step on, 48h can be used, can be resistant to irradiation 7d.
Third, the adhesive
1, the non-flowing type epoxy resin adhesive
The polymeric binder is a two-component epoxy adhesive EP21N for general bonding, fast room temperature curing or curing to 1:1 weight or volume ratio to use.
2, low-viscosity epoxy resin
Industry has excellent mechanical properties and electrical insulation properties at high temperature with a low-viscosity epoxy resin. Tr-Boud2211 continuous use at 190 ℃, solvent-free and easy to mix, and may be used at room temperature.
3, the pressure-sensitive adhesive
Get a new pressure-sensitive adhesive of the transfer characteristics selected to meet the needs of the label and printing applications. Nacro8684 with a high shear, peel resistance, excellent resistance to moisture and cleaning decontamination properties.
4, aluminum with structural adhesive
One-component heat-curing epoxy structural adhesive for bonding an aluminum alloy, and the durability of adhesion were studied hydroxyapatite (HAP) was added relation found, the system containing the HAP did improve the durability of the bond , has nothing to do with the aluminum surface treatment. In other words there is no structural adhesive HAP, durability significantly deteriorated.
5, a polyacrylic acid-modified epoxy resin adhesive particles
Polyacrylic acid-containing microparticles (methyl methacrylate (MMA) - glycerol methacrylate resin (GMA) copolymer) and an epoxy resin adhesive NBP, structural differences CTBN modified epoxy resin binder were a comparative analysis, and studied its adhesive properties of the alloy. The results showed that the use of core-shell particle structure of a polyacrylic acid-modified epoxy resin adhesive and an acrylic rubber-modified epoxy adhesive, internal stress of NBR modified epoxy resin is significantly reduced, significantly improving the bonding strength, acid treatment is not more than processing with a higher chemical resistance.
6, fast fixed, non-sag thixotropic adhesive
Loctitc and Durabond l00NS is a fast fixed, the day hanging drip, thixotropic, two-component industrial grade adhesives for assembly of parts, equipment, electronics and chemical fiber field. This product is cured at room temperature to form a semi-rigid processable layer. When fully cured, can be widely resistant to chemicals and solvents, used as electrical insulation products.
7, toughness adhesive
For high vibration environments developed a low-odor, 5min curing, two-component toughened adhesives, commodity grades for the FCO 9508A and hardener FCO 9508B, which has a high bond strength, shear strength and wet strength.
8, fast mounting adhesive
USA developed a rapid fixing 10min epoxy adhesive, which belongs to the two-component epoxy resin elasticity, suitable for various bonding applications, which have high shear strength, peel strength, impact strength, high chemical resistance, oil sex.
9, medical adhesive
Medical equipment with an epoxy adhesive Pemabond AE98 is a one component rapid low temperature curing, heat-sensitive material suitable for bonding, curing time is between 90-120 ℃ new bond 5-60min Liu. Can be used in radioactive container, bonding finder surgical instruments and other metals, and the casting seal the filter structure.
10, high-strength adhesive sectional
Tra-Bond F202 is a low viscosity, transparent clean material. Its designed for high temperature resistance, chemical resistance and the development of applications. This is also at a temperature of 265 ℃ high strength two-component epoxy adhesive binder, the adhesive and optical fiber materials, including most metals, ceramics, glass, and many plastics.
Fourth, the latent curing agent and a curing accelerator
1, salicylic acid hydrazide latent curing accelerator
Single-hydrazide is added to an epoxy resin curing system diacylhydrazines latent curing accelerator as the sentence, the curing temperature can be reduced without lowering the mechanical properties of the cured product, and its principle is formed with a single hydrazide eutectic alloy.
2, Ajicure PN-31 and PN-40
Ajicure PN-31 and PN-40, A-C from the preparation of the catalyst, is not a latent curing agent, accelerator, for the one-component epoxy resin adhesive. Ajicure PN-40 is below 70 ℃ stable, 90 ℃ can be cured. Its configuration with the one-component epoxy adhesive at room temperature storage period of 9 months big.
3, coating with epoxy resin curing agent
Henkel Corporation introduced Versamine M a 1 CE and Ver-samine M-3CEE epoxy curing agent with low viscosity at low temperature, fast curing, non-fading performance for building projects. Versamine M-1 CE can be used to wet the substrate, apply the ground, the mortar adhesion coating and repair material constituting the liquid epoxy resin. Versamjne-3CEE for high solids epoxy coating, it can be a polyamide, a polyamine amide accelerator.
Fifth, the potting material and casting materials
An elastic epoxy potting compound
Stycast E 1000A / B is a flexible epoxy potting compound, used in automotive, marine and other damping materials, but also for component potting mechanical vibration and thermal cycling environment, its flexibility is designed to protect components. This product is a low viscosity, two component, claimed by the manufacturer which may be cured at room temperature or warming. Air-cured epoxy based automotive, electronic materials for potting
Target applications. Odyssey 6960A and 6960 B is a two component epoxy resin, with a high compression strength, high vibration, excellent electrical properties, the ability of oil moisture and other characteristics. Two-component room temperature curing Durabond 520Ns, its non-sag formula for vertical surface coating can be avoided flowing.
2, thixotropic epoxy resins potting compound
Thixotropic epoxy high thermal conductivity and insulation combining, Tra-Bond 223P01 low cure shrinkage, can be applied to a large area of potting target applications of electronic components, diodes, blocks, transformers, precision resistors or capacitors packaged into a circuit board.
3, epoxy casting material
Insulcast 116 FR epoxy casting material 1: 1 ratio, making it suitable for mixing production line, automatic batching does not allow abrasive ingredients. Low viscosity characteristics of such products allow it to penetrate the dense circuitry to ensure the best double electrically. The potting material can be formulated as room temperature curing type, having a semi-rigid and a sufficient elongation, so that the components to minimize the stress, fast-curing type is also applicable.
Six ring nitrogen resin toughness
1, the thermoplastic polyimide - epoxy resin blend
Doupion energy group with a bifunctional epoxy resin to improve the end-group imide its toughness, its cured product morphology and mechanical properties of the imide compound molecular weight and the type of functional groups, test results showed that when the rupture ductility large deformation, and stress, increased toughness.
2, an epoxy - polyetherimide blend compatibilizers
Synthesis of amine end groups found polyetherimide dimethyl siloxane block copolymer, used as an epoxy resin - polyethylene imine infiltration cool blend compatibilizing agent. Blending resin 4,4 - diamino diphenyl Fen cure. Electron micrograph shows that the epoxy resin - polyetherimide blend cured resin micro-phase separation is present, i.e., the epoxy-rich phase and a polyether imide-rich phase, poor adhesion between the two phases, however, 3% to 5% of the block copolymer as a third component to improve the adhesion between the two phases.
3, modified silicone particles - epoxy resin system
In order to understand the impact of cured epoxy resin system relative dispersion adhesive properties, Takahiro Okamatsu and other preparation containing crosslinked epoxy-modified silicone particles. As the epoxy resin by the addition of amino silanes - modified silicone compatibility agent system, control the size of the dispersed phase micron. Modified silicone particle diameter is reduced, increasing the shear strength and the T- peel strength. Further, to control the curing conditions under which the stable adhesive properties.
4, liquid chloroprene polyurethane prepolymer epoxy resin mixed with a warm object
There are terminal hydroxyl, and a liquid chloroprene rubber of two different diisocyanates prepared by reacting a polyurethane prepolymer, the prepolymer prepared in the block and then with acetone, phenol and ω- caprolactam. Dynamics of viscoelastic and SEM confirmed the island (micro-phase separation) structure. The prepolymer formation reaction with the epoxy resin present in the interface layer of the dispersed rubber particle surface. Modified epoxy resin with excellent adhesion properties can be prepared by controlling the reaction of a blocking agent an isocyanate group.
Seven, liquid crystal epoxy resin
1, the substituent on the properties of liquid crystal epoxy curing
Jun Yeob lce describes the synthesis and other centers with meso substituted aromatic ester liquid epoxy resin based on methyl group as a substituent, and with diamino diphenyl ether as a curing agent for epoxy resins of three kinds found below the decomposition temperature of the cured epoxy resin is a liquid crystal phase is stable.
2, couplet hydroquinone diglycidyl ether (DGE-DHBP) liquid crystal epoxy resin system
Barbara Szczepaniak and other synthetic methods and properties described prepared by DGE-OHBP and bifunctional aromatic compounds liquid epoxy resins. By DGE-DHBP with hydroxy benzoic acid, terephthalic acid and two phenolic hydroxyl chain growth reaction of three kinds of liquid epoxy resin and isophthalic acid, phthalic capped polyether, by reducing the phase transition temperature is used, the polymerization process is melt catalyzed polyaddition, triphenyl phosphate as a catalyst.
3, the liquid crystal epoxy composites
Low-cost liquid crystal epoxy composite is today a hot liquid modified epoxy resin. US National Institute of Standards researchers added 0.2 percent using liquid crystal polymer and liquid crystal coupled with epoxy and polyester to improve strength. This is a low cost method for producing the composite.
Eight, the new system
1, epoxy resin for pultrusion system
US Reichhold launched capable pultrusion processing epoxy resin system. This product consists of two preformed components, and has excellent mechanical strength and electrical properties, can be processed at a wide range of temperatures.
2, Araldite epoxy resin system and Tactix
Ciba has launched epoxy resin systems for aerospace. The system has become an important part of the International Space Station, and successfully used in the US space shuttle.
3, temperature epoxy resin system
Maleimide-modified epoxy resin having an imide group, an imide reaction of the epoxy resin with the allyl-N- phenylmaleimide by containing. The resin cured with diamino diphenyl methane, a glass transition temperature higher than that of epoxy resin trade, 200 ℃ under shear strength correspondingly higher. Infrared spectroscopic measurement revealed that the crosslinking reaction with amines, allyl amines react with the amine with the reaction rate is faster than the epoxy group.
4, sucrose-based epoxy monomer
Two sucrose-based epoxy monomers, epoxy named allyl sucrose (EAS) and epoxy butenyl sucrose (ECS), which are by-octane oxygen-Partenkirchen propyl cane sugar (OAS) and octane butenyl group sucrose (OCS) Preparation of epoxy resin. Synthesis and structural characterization showed a mixture of epoxy monomers is a novel isomers and isomers of asymmetric configuration. Contains a number of different epoxy groups on each sucrose molecule. Epoxy compound containing an average of 1.8 per sucrose molecule epoxy-based EAS and ECS can be prepared.
Diethylenetriamine (DETA) sucrose-based epoxy resins cured polymer begins to degrade at about 320 ℃, which can be bonded aluminum, glass and steel. Relative to the lap shear test showed, DETA cured epoxy allyl sucrose, sucrose per molecule on the average 3.2 epoxy groups (EAS-3.2), the cured product thereof and the diglycidyl ether of bisphenol A with elastic adhesive than belong, and DETA curing ECS-7.3 performance is better than DGBA and EAS-3.2. All sucrose-based epoxy curing and cross-linking can be dissolved in water, dimethylformamide, tetrahydrofuran, acetone and methylene chloride.
5, the production process improvements
Ruetgers Germany has developed a new method for the preparation of an epoxy resin, to reduce the reaction time, the yield is higher than 60%, significantly reduced raw material and moisture. This new method enables the production of higher value-added epoxy resin. The company's subsidiaries will be completed in Duisburg Bakelite production capacity of 25000t / a of industrial scale. This method is advanced in Europe, in the United States is rare.
9. Other
An epoxy moisture barrier
Germany developed the MC-Dur 1101 / MC-Dur 1103M epoxy resin moisture barrier, which is suitable for dams, underground libraries and other buildings and floor coatings, two products are two-component epoxy resin dispersion.
2, the development of flame retardant composition
Dr Neil Brown and Dr Mike Agglcton studied the printed circuit boards (PCBs) used in the manufacture of flame retardant technology. The use of superior grade aluminum hydroxide flame retardants, but the process is slightly different, laminates prepared no environmental pollution.
3, anti-vibration electronic packaging materials
US Fielo Industries company uses two-component epoxy curing system package automated electronic components technology, and that this package has a compressive strength, vibration, oil, water, moisture and shock resistance.
4, epoxy resin-based ink
Japanese medium-sized chemical manufacturers have started production, supply best suited to fill the multi-layer laminate (PCBs) holes special ink, which is fully applicable to high-density laminate filled. There are three types: heatset, UV curing type and a combination of both types.
5, premixed epoxy heat friendly packaging materials
Electronics and aerospace industries with pre-mixed epoxy adhesive heating material class, the basic problem is that once the heat transport will be more heat until the whole into nothing. Brelt Fine without an expensive material such as the development of refrigeration facilities and ships to transport such products, with heat resistance, and has high heat capacity and latent heat of the molten material to produce containers loaded epoxy, for example, various hydrocarbons, petroleum class and the plastic material as well as mixed salts, and paraffin wax is particularly useful. Such heat sink material encapsulated with a plastic bag to avoid any material evaporated, and the whole is enclosed in a polystyrene container dissection, this method has been applied for a European patent, patent number is 0,908,300.
