Abstract: This paper describes the progress of semiconductor packaging materials, including semiconductor packaging materials market in the electronics market, the proportion of material and research results with the development of semiconductor packaging materials semiconductor packaging industry achieved. Keywords: semiconductor packaging materials; supplier of electronic materials; market
1 Introduction
Managing partner companies and Prismark Dr. Shiuh-kaoChiang in 2002 in Shanghai "SEMICOM China 2002Technical Symposium" delivered a speech entitled "Semiconductor packaging materials supply chain," the paper (in English). He is an expert in semiconductor packaging materials, materials science and engineering graduate of the University of Taiwan NationalTsingHua, won the Master of Metal Engineering NotreDame University, Ohio State University, Dr. ceramic engineering and ClevelandState University MBA. He holds numerous patents and more than (papers) academic books and papers in electronic materials, packaging and field processes.
Semiconductor packaging materials is the highlight of electronic materials, the share of first place. With the miniaturization of semiconductor device package, flaky, thin and ball grid array technology for semiconductor packaging materials have become increasingly demanding, expect semiconductor packaging materials towards multi-functional, multi-species and low price-oriented development .
2 Electronic Materials Market
In the past 20 years electronics manufacturing industry has developed rapidly, annual growth rate of 6% -7%, in 2002 the global electronics industry manufacturing market reached $ 1 trillion, including computers, cellular phones, routers, DVD, engine controller and pacemakers. Asia (except Japan) is one of the manufacturing centers in the world electronics industry, which includes 20% China, Taiwan and South Korea, with its market accounting for the global electronics industry manufacturing market, that is $ 20 billion, its annual growth rate more than 10%, while the annual growth rate of the rest of the world is only 5% -6%.
Electronic materials market is the market with the development of the electronics industry and growth of manufacturing, electronic materials market electronics manufacturing industry accounts for about 7% of the market, in 2002 the electronic materials market will reach $ 66.9 billion. Electronic materials market, accounting for 29 percent of active devices, passive devices accounted for 26 percent, accounting for 15 percent interconnect substrate, accounting for 14% energy conversion, data storage, accounting for 8%, system input / output accounted for 5%, assembly, thermal protection layer 3%. The active device includes a semiconductor discretes and IC, which accounted for 22% before the channel material of electronic materials market to reach $ 14.9 billion; Dogo materials accounted for 7%, reaching $ 4.5 billion. The active device material is accounted for heavy head related materials and semiconductor encapsulating material wafer, the wafer processing associated wafer. Before the channel material comprising Si wafer, a glass photomask blank, photoresist, wet chemical reagents, other wafers, resist auxiliary materials, chemical mechanical polishing (CMP) materials, the deposition of the target, and an electrolyte plating and so on. CMP and compound semiconductor wafers in which the fastest annual growth rate of over 11.7%. After the channel material, namely semiconductor packaging materials, including molding compounds, die attach, filler, bonding wire and potting materials. Electronic materials are not included in the above CRT glass shell, optical lenses, copper cable, fiber optic cable, connectors and switches with a polymer, lead-acid battery materials, sheet metal and crates. Electronic materials refer mainly related to the development of the electronics industry engineering materials.
3 supplier of electronic materials
Electronic materials suppliers are occupied mainly by Japanese and American companies. Only a handful of companies in Europe, the success of only one, such as DELO companies. Asian semiconductor packaging materials suppliers (excluding Japan) market began to step into the door of packaging materials, such as Chang Chun, Eternal companies, has become the industry's leading companies, the future is expected to become an important supplier of packaging materials. Table 1 shows the world's 20 largest supplier of electronic materials list, which includes ranking, sales and electronic materials provided. Encapsulation materials suppliers are often electronic materials business in a product group. Table 1 is based on statistical data fiscal year end date of the exchange rate, the Japanese company for the financial year end date 2001,3,31, most other companies the financial year end date for 2000,12,31, foreign exchange rates as follows: $ 1 = ¥ 126.33 € 1.06202.
From Table 1, the semiconductor packaging materials suppliers also by a handful of companies at the "rule" status, as Ablestik is part NationalStarch company, which accounts for 53% of the chip bonding market. SumitomoBakelite and NittoDenko molding compounds the two companies accounted for more than 60% of the market. Loctite / Dexter, Sumitomo and Emerson / Cuming (part of the Nationa lstarch Company) three companies accounted for more than 60 percent potting materials market. Filler by
Locfite, Shiu-Etsu and Namics company at the leading position. Cookson / Alpha and SenjuMetals companies dominate the market in the solder balls.
4 semiconductor packaging materials market
Semiconductor packaging materials market, accounting for about 6.7 percent of the electronic materials market, or accounts for about 23% of the original device materials market, namely $ 4.5 billion. Semiconductor Packaging Materials complicated than before channel material, its diverse nature is increasing. In terms of the weight of each molding compounds to consider, semiconductor packaging materials market in 2002 distributed as follows: 32.8% compound molded leadframe 27.6%, 15.6% bonding wire, shell or cartridge 5. 1%, 4.1% die attach film and with 3.1%, 2.0% solder, inner coating 1.9%, liquid potting 1.5%, LOC with 1.3%, clean flux 1.2%, 1.0%, radiator, other materials 2.8%. Package substrate used as a module substrate, CSP, BGA substrates are included among the interconnect substrate in electronic materials market, technically, they should belong to the semiconductor packaging materials, the 2001 worldwide semiconductor applications substrate material consumption is about 2.4 billion US dollars, in fact, sheet materials and auxiliary materials consumes only $ 200 million annually.
5 semiconductor packaging industry market
Semiconductor packaging materials depends on the development of the semiconductor packaging industry. Although the semiconductor packaging materials suppliers occupation by the Japanese and American companies, but the semiconductor packaging industry in Asia (excluding Japan), this is because the United States, Japan and European semiconductor device manufacturers will be transferred to the semiconductor package developing countries, such as the Asian States. Table 2 shows the global semiconductor packaging industry market, 2001 was $ 21.8 billion, in 2006 will be $ 48 billion, almost more than doubled. Asian countries accounted for about 70 percent of the semiconductor packaging industry market, the key is in Malaysia, Taiwan, the Philippines, South Korea and Singapore, in 2006 will increase China. Development trends of the semiconductor packaging industry are: the growth rate of 12% to 13% more leads to the foot of each package, each pinout less material required, packaging materials and more complex, and more diversity.
Advances in semiconductor packaging materials
One of the progress of semiconductor packaging materials packaging materials are varied functions, and is increasing, which may lead frame from a simple flip-chip packaging and display package comparison ball be seen. The former except si by the following four kinds of materials: a lead frame, the chip bonding, wire bonding and molding compounds. In contrast, the latter requires more than twice the encapsulating material species, such as the substrate, solder mask, solder balls, filling material, and then the distribution of the medium, leads to the projection of high thermal shunt and the thermal interface materials. Such an action would make the semiconductor packaging materials supply chain becomes complicated. 2002, display package only 6.2% of all materials, in 2006 will rise to 15.9%. There are two major factors for semiconductor packaging materials supply chain has an impact, one package size continues to shrink, the second is the increasing complexity of the packaging material of. 28 pin-out devices using a common 28 leads to the foot, at present, 23% of all IC packages at 17-28 lead foot. However, the 28-pin package leads are changing volume and shape, Table 3 shows the 28 pin-out devices, 28-pin devices are being drawn from the DIP to PLCC, SO and TSSOP transition, reducing such molding compounds used to DIP required TSSOP 2% by weight, that is, molding compounds required for each package devices will be less and less, this is undoubtedly the packaging material suppliers is a fatal blow. However, there are three factors supporting the development of packaging materials, one additional complexity of packaging materials, within a certain period can increase the sales price, and second, the packaging industry has 12% of basic annual growth, the three leads each package growing feet. 20 years ago, 28-pin out is the forefront of mainstream semiconductor devices, today will be replaced by 256 pinout devices. Currently, the 256-pin devices only 4% lead all of the IC. In the most dense structure, 256-pin package leads to the consumption of packaging material to be relatively small 28-pin TSSOP lead even more. Table 4 shows the 256 pin-out devices. Lower edge of the device pin-out (28 pin-out TSSOP) and the lead foot high edge devices (256 pinout 0.8mmBGA) leads to the foot of each of the total of the same material is used, exactly molding compounds is less than 2 mg.
And through hole DIP package IC industry is the oldest packaging technology, which uses a lower performance molding compounds, DIP is currently limited to low-end applications. Epoxy resin, cresol, novolak (ECN) is the most basic, the most basic resin. ECN is the lowest price of resin, the average price per kilogram of $ 4-5. Quartz glass (including angular particles of an amorphous structure) is the most basic filler, the average price per kilogram for $ 2. So, DIP molding compound per kilogram of the final sales price of $ 7-9.
PLCC, QFP and other surface mount IC packages using EMC resin, EMC resin adopts advanced ECN / OCN resin or a dicyclopentadiene resin (DCPD), it is compared with the ECN resin having good wet resistance and low stress. EMC resin prices close to $ 6-8 per kg, slightly higher than the DCPD prices. Is a kind of the spherical silica filler, which is molten, it is opposite to the quartz glass, the ball-containing particles, it may be mixed with the quartz glass as a filler material to use. Spherical silica allows tightly encapsulated in the base resin, so that more can be added per unit volume of the filler material, and has good wet resistance. Spherical silica used in proportion with the price and grade changes. The typical price per kilogram is $ 2-3. So molding compounds final sales price per kilogram surface mount package is $ 8-12.
Molding compounds thin surface mount package and display package using the most advanced resin, which is based multifunctional epoxy biphenyls and per kilogram price of $ 12 to 14. Mixed spherical silica filler average price of $ 3-4 per kilogram. So BGA package molding compounds used in the average price per kilogram for 18 to $ 20, which is the most expensive kind of molding compounds.
Due to the miniaturization of semiconductor device package, flaky, thin and balls on display, more and less packaging material used in each device, so that packaging materials suppliers in trouble, forcing packaging material suppliers to adopt more advanced technology to produce advanced packaging materials, packaging materials expect this advanced technology than the low price of packaging material has a good price, many large companies have begun packaging materials led to do so, perhaps tomorrow will bring them profit.
