Higher density, smaller bumps, lead-free processes, the demand for modular products and so need a new packaging technology, packaging technology and innovation, has become the semiconductor and electronics manufacturing technology continues to push the development of the hand, and the semiconductor former Road improved technology and surface mount (SMT) technology to produce a significant impact. Chinese MOS chip plastic materials champion brand in the electronics manufacturing industry, in recent years there has been the integration of active and passive components, analog and digital circuits on the market, and even contains a package module power components, which would mix up the traditional separation of functions technology is making the back-end and front-end assembly component packaging fusion becomes a trend. The new packaging technology to promote the component placement process back-end packaging processes and the gradual integration of front-end processes, accelerating technological innovation generated once triggered SMT.
Recently, by SEMICOM Taiwan 2011 held on the occasion, SMT solutions renowned supplier of security will be expensive (Assembléon) launched a Hybrid solutions for semiconductor manufacturing new A-Series, which is Assembléon first entry into the semiconductor manufacturing market, but also indicates more number of SMT solutions vendor response to market demand, advance to the upstream industry chain.
Currently, positioning packaging technology from the connection, the general assembly of production technology has evolved as a key technology for the realization of highly diverse electronic information equipment. A-Series Hybrid will Assembléon mature parallel placement technology to back-end applications related to system-level packaging, multi-chip module manufacturing and flip chip bonding and so on. Parallel placement technology work together Assembléon's unique programmable force control patch, which solves the semiconductor back-end process of a common problem - because of the lack of process control patch caused by component damage.
In the original process flow, SiP, MCM and high performance flip-chip modules need to use a variety of equipment to mount chip components and chips, but now only one machine will be able to accomplish these tasks, Assembléon that the true meaning of this stand-alone solution that can reduce production and investment costs for module manufacturers. In addition, the use of sophisticated parallel placement technology also helps to improve the quality of the semiconductor end-product, completely manufactured to meet the market demand for modular products.
If the flip-chip bumps generation process backward channel package is an extension of the front-end semiconductor, then wire bonded silicon-based generation is the packaging technology bumps ahead Road extension process. We can easily observe, there multichip module (MCM) for components, systems or machine packaging technology, has revolutionized the concept of the package just for the device, because the MCM technology is a set of PCB, hybrid circuits, SMT and semiconductor technology in an aggregate, so we can call reservations device physics prototype system.
It can be said, components SMT technology is the driving force of development, SMT placement technology was largely swayed components, while also promoting the progress of SMT chip packaging technology continues to improve. Such as chip components is the first application, the largest output of surface mount components, SMT ever since the formation of the corresponding IC package is suitable for SMT has developed a short lead or no lead LCCC, PLCC, SOP and other structures. Four side-pin flat package (QFP) realized on the use of SMT surface mount PCB or other substrate, BGA pin pitch QFP ultimate solution to the problem, CSP replace QFP already is the trend, and flip chip bonding process underfill now also been used in CSP devices.
However, SiP, MCM, 3D and other new forms of packaging uses, makes the problem encountered in the production of electronics manufacturing today are increasing. Because of the complex multi-chip module package physical design, size, or not a certain standard pin-out, which led to the market, although new packages are available to meet the functional requirements and time to market for new products, but its technological innovation while filling SMT complicates and increases the cost of the corresponding assembly. With passive components, and IC, etc. embedded in the interior of the substrate using a large number of 3D packages, wire bonding, CSP ultrasonic welding, DCA, PoP (stacking assembly techniques), have already entered the board assembly process range. Therefore, SMT, if not quickly adapt to new packaging technology will be difficult to sustain development.
In order to meet the convergence trend backend component packaging and front assembly, and only close cooperation between the packaging industry and their equipment suppliers and SMT manufacturers and equipment manufacturers, in order to truly meet the market demand for consumer electronic age. Equipment and configuration decisions by the process, which will lead to the future development of China's electronics manufacturing and semiconductor packaging industry will tend integration. Chinese semiconductor package is in the stage of rapid development, the expansion of the electronic assembly industry seems to have slowed the trend. Under this context, strengthening the package, technology exchange and collaboration between the SMT industry, will China semiconductor packaging, electronics assembly industry sustained rapid development has played a positive role in promoting.
